Purchasing components from the wrong or non-qualified suppliers can be a dangerous thing. We hear too many times in this industry about OEM's who receive the wrong parts, sub-standard parts or even worse, counterfeit parts.
This is where MMI separates itself from other distributors. You parts must pass our 15 point inspection process (SEE QMS RECEIVER SECTION) prior to being accepted into our warehouse. In order to achieve unparalleled risk mitigation and eliminate counterfeit components we utilize an ISO:9001/AS9100 REV C CERTIFIED 3rd-party testing facility. This ensures no tampering, remarking or non-conforming incidents have taken place.
There are numerous testing services MMI is able to provide our end users.
Incoming inspection is the process of verifying the conditions of materials used for shipping. At MMI we will check for box damaged, ESD protection, type of package, humidity indicator card (HIC) pass H2O test, correct MSL packaging, documents match and country of origin.
External visual inspection is the process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality. Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A. Visual Inspection is a term used for inspecting electronic components under a microscope to determine if a device has been altered from its original state. During this process a device may show signs of non conformance or inconsistencies that help determine if a device has been used. This process is performed by a Components Test Lab. This process is non-destructive and devices can be used afterwards. Here are examples looked for during a visual inspection of IC Devices:
This test process determines if the device has been remarked or resurfaced. A common counterfeiting technique suppliers use is taking an older date code or slow speed devices, refurbishing them to appear new and marked as higher grade with a recent date code or as RoHS compliant. Counterfeiters have access to reclaimed, scrapped and excess parts, which are readily available from unauthorized sources. These tests are considered a destructive test. Re-Surfacing / Re-Marking test are based on AS5553, MIL-STD-202 and JESD22-B107C.
Heated Chemical Test or HCT is performed on an electronic component or IC device to check for a secondary coating. This process is performed by heating a specific chemical to a certain temperature. Once temperature is reached, a plastic IC device is submerged half way into the chemical. When left over a specific period of time the partially cured resins, paint, blacktop, or secondary coating will be dissolved. After this process is complete a clear picture is taken under a microscope to show a secondary coating if the device had one. A secondary coating is not the only thing the HCT reveals during this process. Because the coating is removed during this process on a refurbished device, other things can be seen like:
• Exposed sanding marks from sanding process
• Bead blasting marks on the surface of the device
• Previous device markings
• Pin indicator
• Remark devices to all one date code
• Change speed grade rating from C (Commercial) grade to I (Industrial)
• Covering pull marks, chips, cracks, or other inconsistencies
• Exposed bond wires
INTERNAL DECAP VERIFICATON:
Decapsulation inspection is the process of verifying the manufacturer die. This is considered a destructive test. Once the die is exposed the attributes of the die, such as die markings, metallization damage due to ESD or corrosion will be verified. Decapsulation is performed on 1 sample per lot code or date code based on MIL-STD-883, Method 2014
X-ray inspection is a non-destructive test. It is the process to verify the bond wire connections, die size comparison and ESD damage. Counterfeit devices can be determined by comparing the structure of the die to a known good device. Part should be identical from bond wire location to die size. X-Ray is based on AS5553 and MIL-STD-883 2012.7.
XRF can be carried out on the parts to evaluate the material composition of the terminations and the molding compound in order to detect the presence or absence of Pb and other discrepancies with an authentic part. It is a non-destructive test. A complete graph will be provided with a list of substances found. The EU RoHS Directive (2011/65/EU) restricts the maximum allowable levels of lead (Pb), cadmium (Cd), mercury (Hg), hexavalent chromium (Cr6+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants to 0.1% or 1000ppm (except for cadmium, which is limited to 0.01% or 100 ppm) by weight of homogeneous material in electrical equipment and electronic products. In order to manufacturer these products within or import into the European Union, manufacturers are responsible for providing due diligence documentation.
FULL AC/DC ELECTRICAL TESTING:
MMI's 3rd party test house offers wide range of electrical testing from basic DC limited function to full DC/AC function including up-screening of all types of devices. We are equipped with a wide variety of digital and linear test equipment to verify electrical operating conditions of active, passive, and discrete components utilized on various electronic assemblies. Typically, our clients specify different environmental test conditions depending on industry compliance requirements (i.e., Military, Automotive, Medical, etc.).
Solderability is a test to determine if the components will have soldering issues at the contract manufacturer. Especially with older date code components, the leads can have oxidation resulting in components not being able to solder to the board. This can result in mechanical failure which will delay the CM process and increase cost. It is recommended that all lead devices that are more than two years old shall subject to Solderability test.
We have the ability to test and inspect LVDS LCD screens up to 42 inches. The common problems we look for on LCD screens are: Re-furbished sold as new, Wrong voltage, Cracks on LCD Screen, Physical Damage, Scratch on LCD Screen, Lines on LCD Screen, Color Uniformity, Pressure Marks on LCD Screen, Dead Pixel on LCD Screen, Backlight Damage, Inverter JTAG and BOUNDARY SCANNING:Similar to In-Circuit Test (ICT), JTAG / Boundary Scan utilizes thousands of test points – with only four test access points. The Boundary Scan cells are integrated between core logic and physical contact pins. They enable the test of connections between the pins of IC's, even those without Boundary Scan cells. JTAG / Boundary Scan is very versatile and can be utilized in the entire production process, e.g. for emulation, design verification, prototype and production test as well as on-chip and in-system programming.
BAKING AND DRY PACKING:
Many devices are moisture sensitive and with improper packaging this can cause major issues for the end user. Moisture induced interface delamination begins with the package absorbing moisture form the environment, which condenses in micropores in polymer materials such as the substrate, die attach and molding compound. During PCB assembly process, when the part is exposed to high temperatures associated with the soldering process, popcorning may occur. We can eliminate these problems by baking and dry-pack of all moisture sensitive devices prior to leaving our facility. This process is based on J-STD-033B-1.
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